[PageStream 2 document SP_MFG_4.DOC: 8.50 x 11.00 in, 2604 objects] --- Page 25 --- 4.0 ASSEMBLY PROCEDURE 4.1 Memory PCB assembly Refer to separate bill of material and assembly drawing. 1. Material preparation 1.1 Handling Protective measures shall be taken to prevent damage to static sensitive components. 1.2 Incoming inspection Preform AQL inspection on incoming component lots as described in section 2.0. 1.3 PCB baking PCBs shall be baked in an oven for 4 hours at 105° C ± 5° C. PCBs shall be allowed to cool for 2 hours minimum after baking. 1.4 Load automatic placement equipment Prepare components for automated palcement and insertion onto PCB 2. SMD component placement 2.1 Apply solder paste Screen solder paste onto component side of PCB. 2.2 Automatic pick and place chip capacitors SOJ ICs 3. IR reflow oven 3.1 Conveyor speed _______ meters per minute 3.2 Oven temperature profile Stage #1 ______ °C Stage #2 ______ °C Stage #3 ______ °C Stage #4 ______ °C 3.1 Cooling period _______ minutes minimum CA401292-001 ASSY PCB 1MB DRAM (8) 256K x 4 DRAMs CA401292-002 ASSY PCB 4MB DRAM (8) 1Meg x 4 DRAMs --- Page 26 --- 4. SMD component visual inspection 4.1 Component placement Correct components are placed in the correct location, and oriented correctly. 4.2 Edge and toe solder fillets Prefered - good solder flow and wetting around edges and toe of component lead, with a continuous smooth coating of solder over the topside of the leads. Acceptable - reduced solder flow and wetting around edges of toe of component lead. Rejected - no evidence of flow around edges and toe of component lead. 4.3 Heel solder fillets Prefered - Good solder fillet evident at heel of component lead. Acceptable - reduced solder fillet at heel of lead not less than midpoint of lower bend. Rejected - no visible solder fillet at heel of lead. 4.4 Lead alignment Prefered - leads shall be centered and aligned parallel to land. Acceptable - at least 50% of lead is on land, and does not overlap at any one point to the extent that the minimum spacing requirements are violated. Rejected - minimum spacing violated. 4.5 Lead surface contact Prefered - toe or heel raised from land not more than 2 times lead thickness with remaining lead close to the land surface. Acceptable - toe or heel raised from land more than 2 times and less than 4 times lead thickness with smallest gap between lead and land less than twice the lead thickness. Rejected - smallest gap between lead and land exceeds twice the lead thickness, or cracks are evident in any portion of the solder connection. 5. Install connectors 5.1 Manually insert socket connectors on bottom side so that the leads stick out on the top side. 5.2 Manually solder the socket connectors from the top side of the PCB. 6. Configure the 1Meg select jumper J2 1Meg version, -001: shorted (apply solder from pad to pad creating a short circuit) 4Meg version, -002: open (no connection from pad to pad) 7. Cleaning Remove flux residues and any other contaminants with appropriate solvent. 8. Marking 8.1 Version number - mark the PCBA, where indicated by the assembly drawing, with the assembly version number.using white epoxy ink. 8.2 Revision letter - mark the PCBA, where indicated by the assembly drawing, with the assembly revision letter.using white epoxy ink. --- Page 27 --- [1805 drawing objects, see SP_MFG_4.DOC.p027.svg] 9. Final visual inspection 9.1 Component placement Correct components are placed in the correct location, and oriented correctly. 9.2 Horizontal mounting Prefered - entire body length of component is contacting the board. Acceptable - closest point between component body and board(H) less than 0.060 inches, furthest separation (D) less than 0.080 inches, component body parallel so that D-H is less than 0.050 inches. Rejected - H value greater than 0.060 inches, D value greater than 0.080 inches, D-H value greater than 0.050 inches. 9.3 Plated through hole solder fillets Prefered - no void areas or surface imperfections of solder fillet around lead. Fillet slightly convex, good wetting, solder covers lead and feathers out to a thin edge on land, and solder coverage is neat and bright.Contour of lead clearly visible. Acceptable - fillet does not extend to land edge, but wetting is complete and well feathered to lead surface and 80% of the land. Solder is recessed into hole 25% but extends 360 degrees around the lead and wets 80% of the land surface. Rejected - large void, pinholes, reduced wetting area, more than one void in the solder joint, excess fillet, solder bridged to adjacent conductor, or no filleting or wetting to land surface. 9.4 Marking Version number - check to see if the correct assembly version number.is marked on the PCB in white epoxy ink. Revision letter - check to see if the correct assembly revision letter.is marked on the PCB in white epoxy ink. 9.5 Cleanliness No flux residue on electrical contact surfaces. No flux entrapment in and under components. No dirt or particulate matter on assembly. No fingerprints on conductors, components, or contact surfaces. --- Page 28 --- 4.2 Falcon 030 PCB assembly Refer to separate bill of material and assembly drawing. 1. Material preparation 1.1 Handling Protective measures shall be taken to prevent damage to static sensitive components. 1.2 Incoming inspection Preform AQL inspection on incoming component lots as described in section 2.0. 1.3 PCB baking PCBs shall be baked in an oven for 4 hours at 105° C ± 5° C. PCBs shall be allowed to cool for 2 hours minimum after baking. 1.4 Apply solder masking Apply solder mask to the 4 fan bracket mounting holes Apply solder masking to J22 plated thru holes Apply solder masking to L61 plated thru holes Apply solder masking to C224 plated thru holes Apply solder masking to J1 plated thru holes Apply solder masking to J7 and J8 plated thru holes 1.5 Load automatic placement equipment Prepare components for automated palcement and insertion onto PCB 2. Bottom side SMD component placement 2.1 Apply component glue apply component glue to solder side of PCB. 2.2 Automatic pick and place chip capacitors chip resistors 3. Top side SMD component placement 2.1 Apply solder paste Screen solder paste onto component side of PCB. 2.2 Automatic pick and place chip capacitors chip resistors SO ICs PLCC ICs QFP ICs PLCC sockets CA401332-001 ASSY PCB FALCON 030 NTSC CA401332-002 ASSY PCB FALCON 030 PAL-I CA401332-003 ASSY PCB FALCON 030 PAL-B CA401332-004 ASSY PCB FALCON 030 PERITEL --- Page 29 --- 4. IR reflow oven 3.1 Conveyor speed _______ meters per minute 3.2 Oven temperature profile Stage #1 ______ °C Stage #2 ______ °C Stage #3 ______ °C Stage #4 ______ °C 3.1 Cooling period _______ minutes minimum 4. SMD component visual inspection 4.1 Component placement Correct components are placed in the correct location, and oriented correctly. 4.2 Edge and toe solder fillets Prefered - good solder flow and wetting around edges and toe of component lead, with a continuous smooth coating of solder over the topside of the leads. Acceptable - reduced solder flow and wetting around edges of toe of component lead. Rejected - no evidence of flow around edges and toe of component lead. 4.3 Heel solder fillets Prefered - Good solder fillet evident at heel of component lead. Acceptable - reduced solder fillet at heel of lead not less than midpoint of lower bend. Rejected - no visible solder fillet at heel of lead. 4.4 Lead alignment Prefered - leads shall be centered and aligned parallel to land. Acceptable - at least 50% of lead is on land, and does not overlap at any one point to the extent that the minimum spacing requirements are violated. Rejected - minimum spacing violated. 4.5 Lead surface contact Prefered - toe or heel raised from land not more than 2 times lead thickness with remaining lead close to the land surface. Acceptable - toe or heel raised from land more than 2 times and less than 4 times lead thickness with smallest gap between lead and land less than twice the lead thickness. Rejected - smallest gap between lead and land exceeds twice the lead thickness, or cracks are evident in any portion of the solder connection. --- Page 30 --- 5. Install through hole parts 5.1 Axial lead part automatic insertion resistros inductors diodes electrolytic capacitors fuses 5.2 Radial lead part automatic insertion film capacitors tantalum capacitors transistors filters crystals 5.3 DIP lead part automatic insertion DIP ICs DIP sockets oscillators delay line 5.4 Manual insertion connectors 6. Wave solder 6.1 Boards shall be passed through solder wave with the following parameters a) Solder flux shall be water soluble b) Speed of throughput shall be 4-6 feet per minute c) Pre-heat temperature shall be 95°C ±5°C d) Solder wave temperature shal be 250°C ±5°C e) Component lead shall remain in solder wave for 3-5 seconds maximum 6.2 After solder delay After soldering, boards shall be allowed to cool at room temperature without touching for 90 seconds ±30 seconds. 6.3 Cleaning After solder dealy, boards shall be run through aqueous cleaner for cleaning and drying. --- Page 31 --- 7. Touch-up 7.1 remove solder masking 7.2 install hand soldered parts hand solder the following parts after cleaning: L61, C224, J1, U4, J7, and J8 7.3 Configure the system configuration jumpers U56 and U57 apply solder from pad to pad creating a short circuit across the following pads: U56 pin 3 to pin 14 U56 pin 4 to pin 13 U57 pin 7 to pin 10 7.4 Cleaning Remove flux residues from manual soldering with appropriate solvent. 7.5 Insert the following DIP ICs into sockets: U62, U63, U67, U68, U44 (note: these parts must be programmed before installation) 7.6 Insert the following PLCC ICs into sockets: U28, U51 (note: U51 must be programmed before installation) 7.7 Jumpers Intall a 2pin shorting plug at the following locations W10 pin 2 to pin 3 J20 pin 20 to pin 22 8. Marking 8.1 Serial number - apply an adhesive label to the PCBA bearing the PCBA serial number. Refer to the PCBA assembly drawing for the serial number definition. 8.2 Version number - mark the PCBA, where indicated by the assembly drawing, with the assembly version number.using white epoxy ink. 8.3 Revision letter - mark the PCBA, where indicated by the assembly drawing, with the assembly revision letter.using white epoxy ink. --- Page 32 --- 9. Final visual inspection 9.1 Component placement Correct components are placed in the correct location, and oriented correctly. 9.2 Horizontal mounting Prefered - entire body length of component is contacting the board. Acceptable - closest point between component body and board(H) less than 0.060 inches, furthest separation (D) less than 0.080 inches, component body parallel so that D-H is less than 0.050 inches. Rejected - H value greater than 0.060 inches, D value greater than 0.080 inches, D-H value greater than 0.050 inches. 9.3 Plated through hole solder fillets Prefered - no void areas or surface imperfections of solder fillet around lead. Fillet slightly convex, good wetting, solder covers lead and feathers out to a thin edge on land, and solder coverage is neat and bright.Contour of lead clearly visible. Acceptable - fillet does not extend to land edge, but wetting is complete and well feathered to lead surface and 80% of the land. Solder is recessed into hole 25% but extends 360 degrees around the lead and wets 80% of the land surface. Rejected - large void, pinholes, reduced wetting area, more than one void in the solder joint, excess fillet, solder bridged to adjacent conductor, or no filleting or wetting to land surface. 9.4 Marking Version number - check to see if the correct assembly version number.is marked on the PCB in white epoxy ink. Revision letter - check to see if the correct assembly revision letter.is marked on the PCB in white epoxy ink. 9.5 Cleanliness No flux residue on electrical contact surfaces. No flux entrapment in and under components. No dirt or particulate matter on assembly. No fingerprints on conductors, components, or contact surfaces. --- Page 35 --- 4.3 System assembly Refer to separate bill of material and assembly drawing. 1. Material preparation 1.1 Handling Protective measures shall be taken to prevent damage to static sensitive components. 1.2 Incoming inspection Preform AQL inspection on incoming component lots as described in section 2.0. CA401273-001 ASSY MAIN FALCON 030 US CA401273-002 ASSY MAIN FALCON 030 CAN CA401273-003 ASSY MAIN FALCON 030 UK CA401273-004 ASSY MAIN FALCON 030 FRA CA401273-005 ASSY MAIN FALCON 030 GER CA401273-006 ASSY MAIN FALCON 030 ITA CA401273-007 ASSY MAIN FALCON 030 NET/UK CA401273-008 ASSY MAIN FALCON 030 NET/FRA CA401273-009 ASSY MAIN FALCON 030 SPA CA401273-010 ASSY MAIN FALCON 030 SWG CA401273-012 ASSY MAIN FALCON 030 SWD CA401273-014 ASSY MAIN FALCON 030 AUS CA401273-020 ASSY MAIN FALCON 030 SWF --- Page 36 --- [725 drawing objects, see SP_MFG_4.DOC.p036.svg] 2. Top case assembly 2.1 Install nameplate on top cover a) check nameplate for damage, flaws, or dirt b) check top cover for damage, flaws or dirt c) remove protective backing from adhesive side of nameplate d) firmly press the nameplate into the recessed area on the top cover e) make sure nameplate is square with the top cover and centered in the recessed area 2.2 Install plastic LED indicators (x 2) a) check indicator for damage, flaws, or dirt b) install the indicator into the recessed opening inside the top cover c) melt the two tabs inside the top cover with a soldering iron to secure the indicator d) make sure the indicator is flush with the recessed opening inside the top cover and that the indicator is clearly visible from the outside of the top cover nameplate C302777 top cover C302784-003 indicator C070031 2 places --- Page 37 --- 3. PCBA, insulator, shield assembly 3.1 Install PCB insulator into bottom shield a) Check insulator for damage, flaws, or dirt b) Check bottom shield for damage, flaws, or dirt c) Install PCB insulator into bottom shield d) Make sure insulator holes are aligned with holes in bottom shield. Bend insulator at perforations so that fan holes are aligned 3.2 Install the PCBA into the bottom shield a) Check PCBA for damage, flaws, or dirt b) Install PCBA into bottom shield c) Make sure rear edge of PCBA is flush with back of shield, and I/O connectors fit through shield. 3.3 Install the top shield over the PCBA a) Check top shield for damage, flaws, or dirt b) Install top shield over PCBA and bottom shield c) Make sure the top and bottom shields are aligned properly d) Bend the 4 hooks which secure the top and bottom shield e) Install 6 M3x5 pan head screws as shown --- Master page (repeated on pages; # = page number) --- [32 drawing objects, see SP_MFG_4.DOC.mR.svg] SIZE DRAWING NO. REV ® ATARI CORPORATION A SCALE NONE C302758-001 SHEET OF 1 _